Integration at substrate level
Due to increased demand for high-performance but cost-efficient solutions, extended functionalities are also integrated at package or module level using established technologies. This allows our developers to integrate several components into one package (system-in-package – SiP). Several packages can also be stacked three-dimensionally (package-on-package). Use of 3D-technologies at circuit-board level is also increasing. One new assembly method here is embedding bare dies in the substrate. In the future integrating optical functions will also be possible.