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In 10 departments Fraunhofer IZM scientists are conducting research in all realms of electronic packaging, covering everything from material selection, simulation, design and interconnection technologies at wafer, chip and board-level to the environmental impact of microelectronics.

Substrate Integration Technologies

  
System Integration & Interconnetion Technologies
Head: Dr. Martin Schneider-Ramelow & Rolf Aschenbrenner
Polytronic Systems
Head: Prof. Dr. Karlheinz Bock
PCB Soldering Training/Qualification and Micro Mechatronics
Head: Dr. Ralph Stömmer

Wafer Level Integration Technologies

  
Si Technology and Vertical System Integration
Head: Dr. Peter Ramm
High Density Interconnect & Wafer Level Packaging
Head: Oswin Ehrmann
Nanomaterials and Devices
Head: Prof. Ignaz Eisele

Materials, Reliability and Sustainable Development

  
Micro Materials Center
Head: Prof. Bernd Michel
Environmental Engineering
Head: Dr. Nils Nissen

System Design

  
Micromechanics, Actuator and Fluidics
Head: Dr. Martin Richter
System Design & Integration
Head: Dr. Stephan Guttowski

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