Regardless of whether you already know your way around electronic packaging or are just beginning to consider investing in this technology, we can answer your questions and support you on your way. Our customer spectrum is as wide as our technology portfolio and ranges from the automotive industry, to mechanical engineering, through to medical, communications and security technology. We have helped companies in areas as diverse as clothing, lighting, foodstuff and logistics improve their products by integrating electronics. Don’t hesitate to contact us!

Understand technology and invest in the future
You know your way around electronic packaging and want to benefit from our latest developments. We can collaborate with you to develop customized solutions for miniaturizing and integrating microelectronic systems into your products. Our development services are tailored to your requirements and our solutions range from the small details through to complete systems.

• Consultation
• Feasibility studies
• Participation in publicly-funded research projects
• Bilateral contract research right through to prototype manufacture and
• Quality, reliability and environmental solutions

The advantages of contract research
Bilateral contract research means that we develop innovative technologies and product-oriented solutions exclusively for you and your company’s requirements. The benefits of direct access to a highly qualified, interdisciplinary research team include:

• Assured results
• Time and cost savings
• Professional project management
• High quality standards

Satisfied customers in medium-sized industry
Research and high-tech development is not just for large companies. Many medium-sized companies also make use of our expert know-how. One of the best arguments for cooperating with Fraunhofer IZM are our many satisfied customers, as proven by our high rate of follow-up contracts.

Using technologies for the first time
You want to increase the value of your products, but have not yet invested in electronic technologies or only to a small extent. Despite this, you would like to benefit from the advantages of modern assembly and interconnection technology and microsystem technology and utilize the know-how and the technology transfer we offer? Then the right address is Fraunhofer IZM’s Smart System Integration application center, which is supported by the German federal ministry for education and research. At the center, we take your ideas and select the right solution for your product environment from Fraunhofer IZM’s extensive technology portfolio. We consult with you, determine the technical viability, conceive and develop solutions customized for your products.